bonding

Epoxy.com Chemical Resistant Chart of Popular Products

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Chemical Resistance Chart of Popular Epoxy.com Coating and Mortar Systems

Chemical

# 1

#2

# 630

# 633

Vinyl Ester #663
Acetone NR NR S-3 S-3 S-3
Acetic Acid – 56% 5%-S-3 10% 20% S-2 +
Acetic Acid – 84% NR NR ND S-2 S-2
Acetic Acid (Glacial) NR NR NR S-3 S-1
Aluminum Chloride – 30% NR ND + + +
Aluminum Nitrate – 50% NR ND + + +
Aluminum Sulfate – 50% NR ND + + +
Ammonium Hydroxide -30% S-3 S-2 + + S-1
Ammonium Sulfate – 50% NR S-2 + + +
Ammonium Sulfide -50% NR S-2 + + +
Barium Sulfate NR S-1 + + +
Barium Sulfide NR S-1 + + +
Beer S-2 + + + +
Benzene NR NR S-2 S-2 S-2
Benzyl Alcohol NR S-2 + + S-2
Black Liquor NR ND + + +
Butyl Acetate NR S-3 + + +
Butyl Acetate (Normal) NR ND ND + +
Brake Fluid ND + + + +
Butanol (Normal) NR S-3 + + +
Calcium Chloride NR S-2 + + +
Calcium Hydroxide ND S-2 + + +
Carbon Tetrachloride NR S-3 ND + +
Citric Acid -40% S-3 S-1 S-1 S-1 +
Corn Oil ND + + + +
Crude Oil – Sour NR + + + +
Crude Oil -Sweet NR + + + +
Cumene NR S-3 ND + +
Cutting Oil NR S-1 + + +
Cyclohexeone NR S-3 S-3 + +
Diacetone Alcohol NR S-2 S-2 + +
Diesel Fuel + + + + +
Diethylene Glycol ND + + + +
Distilled Water ND + + + +
Ethanol NR S-2 + + S-1
Ethyl Acetate NR S-2 + + S-2
Ethyl Alcohol NR S-2 + + S-2
Ethylene Dichloide NR NR S-1 S-1 ND
Ethylene Glycol ND + + + +
Ethyl 3-Ethoxypropionate ND ND ND + ND
Ethylene Oxide NR ND ND + +
Ethlene Glycol Monopropyl Ether NR ND ND + ND
Freon ND ND S-1 S-1 ND
Fuel Oil ND + + + +
Gasoline (Unleaded) ND S-2 + + +
Gasoline (Premium Unleaded) ND S-2 + + +
Glucose NR S-1 + + +
Glycerine NR + + + +
Glyoxal – 40% NR ND + + S-2
Heptane NR S-2 + + +
Hexane NR S-2 + + +
Hexalene Glycol S-3 S-1 + + +
Hydraulic Fluid ND S-1 + + +
Hydrochloric Acid -10% S-2 S-1 + + +
Hydrochloric Acid 36% NR S-2 + + +
Hydrogen Peroxide -5% S-3 S-1 + + +
Hydrogen Peroxide – 30% NR S-2 ND + +
Iodine NR S-3 (Stain) + + +
Isobutyl Alcohol NR S-2 + + +
Isopropyl Alcohol NR S-2 + + +
JP – 4 Jet Fuel S-2 S-1 + + +
JP – 5 Jet Fuel S-2 S-2 + + +
Kerosene NR S-2 + + +
Ketchup S-3 + + + +
Lactic Acid – 50% NR S-2 + + +
MAK NR ND ND + ND
MEK NR NR S-3 S-3 S-3
Methanol NR ND + + S-2
Methylene Chloride NR NR NR NR NR
MIBK NR NR S-2 + S-2
Mineral Spirits NR S-3 + + +
MTBE NR NR + + ND
Naptha (VMP) NR S-3 + + +
Nitric Acid – 10% NR S-1 + + +
Nitric Acid – 30% NR NR NR NR +
Oxalic Acid NR ND + + +
Para Xylene NR ND ND + ND
Peanut Oil NR S-3 + + +
Perchloroethylene NR NR + + +
Phosphoric Acid – 10% S-3 + + + +
Phosphoric Acid -75% NR S-3 + + +
Phosphoric Acid – 85% NR S-3 + + +
Power Staring Fluid ND S-2 + + +
Propylene Glycol Monomethyl Ether NR ND ND + ND
Propylene Glycol Monomethyl Ether Acetate NR ND ND + ND
Pseudocumene NR ND ND + ND
Skydrol 500B S-2 + + + +
Sodium Hydroxide -50% + + + + +
Sodium Hydroxide – 70% NR S-2 + + S-2
Sodium Hypochlorite – 10% ND + + + +
Sodium Nitrate – 50% NR S-2 + + +
Sulfamic Acid ND S-1 + + +
Sulfuric Acid – 10% + + + + +
Sodium Bisulfiate ND ND ND S2 ND
Sulfuric Acid 50% S-3 S-2 + + +
Sulfuric Acid 70% NR NR + + +
Sulfuric Acid 98% NR NR S-1 + S-2
Toluene NR S-3 + + +
Tomato Juice NR S-2 + + +
Transmission Fluid NR S-2 + + +
1.1.1 Trichloroethane NR NR ND + +
Urine NR + + + +
Vinegar NR NR + + +
Vinyl Tolene ND ND + + +
White Liquor ND ND + + +
Xylene NR S-1 + + +
+ = Continuous Service (greater than 6 months)

S1 = Splash and Spill with Weekly Cleanup

S2 = Splash and Spill with 24 hour Cleanup

S3 = Splash and Spill with Hourly Cleanup

NR= Not Recommended

ND= No Data

Factors such as temperature, application,
Exposure, Etc. are beyond the control of
Epoxy.com a division of  Epoxy
Systems, Inc. No warranty concerning these studies can be made.  Samples should be tested under actual
or simulated condition for final decision on the suitability of the system.
April 14, 2011

Tombstone Repairs with Epoxy

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A technician who uses a non-Epoxy.com product to repair tombstones wrote me recently looking for help with problems that he was having.  He goes on to say that the epoxy that he uses never fails, but rather the stone fails. When a secondary break occurs, the stone always re-breaks about 2 mm (about ¾ inch) above or below the epoxy joint.  The epoxy attached to about 2 mm of the stone and holds well.

He asked me if the epoxy shrinks so much that it will ‘ pull away ‘ from the stone it’s attached to, and in his case, it pulls about 2mm of stone with it.

No I doubt it is epoxy shrinkage causing the problem. High quality epoxy has little or no shrinkage.  It would have to be a very poor quality epoxy to be shrinking enough to do that.

The reason his epoxy is not working is that it is too rigid.  His existing rigid material has a “high modulus of elasticity”.  A material with “high modulus of elasticity” is a material that is stiff and/or rigid.  A “low modulus of elasticity” material is semi-flexible, and is not rigid or brittle.

Smaller pieces of the stone structure (in this case a tombstone) and pieces not in touch with the ground tend to get hotter and cooler faster than the larger pieces and pieces with ground contact. This is called “differential timing of the event”. For example the top of a tombstone can be heated and cooled on 5 sides, the top and the 4 sides. The base of the tombstone which is buried in the ground has earth or stone on all of its surfaces.  This earth and stone tends to keep the temperature of the base more stable by insulating it and slowing the change in temperature. This works much like the insulation in your house slows temperature changes inside your house.

When an object like a piece of stone is heated it expands (gets bigger).  When an object cools it contracts (gets smaller).  For example 100 feet of concrete will be 1 inch longer once it is heated 100 degrees F.  That is why expansion joints are cut into concrete.

In the case of tombstones all the pieces of the same type of stone have very similar if not identical “coefficient of expansion”. Since the pieces are positioned with potentially different timing of heating and cooling there is a “differential timing of the event” (see above). The result is stress areas you are seeing in the closest weakened plane in the stone near the bond line.

Product #2005  was specifically designed for tombstone (monuments) and/or stone bonding, or repair. Epoxy.com Product #2005 is very strong yet it is has a “low modulus of elasticity” (semi-flexible).  The low-modulus of elasticity helps to absorb differential movement (two sections of stone heating and cooling at different times), making it much less likely to cause a stress area in adjacent weakened planes.

Camouflage the bond line rubbing stone dust(ground off the original stone or a similar colored stone) into any exposed epoxy material while the epoxy is still “wet”. That way the dust will stick in the wet epoxy making the epoxy difficult to impossible to see.

Please send your additional question and blog ideas to norm@epoxy.com